TBS
Thermal Bonding System
TBS
Thermal Bonding System
Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.
TBS
Thermal Bonding System
TBS
Thermal Bonding System
Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.
RRS
Cured Resin Remover Solvent
RRS
Cured Resin Remover Solvent
RRS is a special blend of solvents designed to swell, soften and in some cases dissolve cured coatings and resins, including epoxy and polyurethane chemistries. RRS does not contain methylene chloride
GP300
Thermal Gap Pad
GP300
Thermal Gap Pad
GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.
HTCPX
Thermal Gap Filler
HTCPX
Thermal Gap Filler
HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
HTCX
Non-Silicone Thermal Interface Material
HTCX
Non-Silicone Thermal Interface Material
Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).
HTS
Silicone Heat Transfer Compound
HTS
Silicone Heat Transfer Compound
Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.
HTC
Non-Silicone Thermal Interface Material
HTC
Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
SC2001
Heat Cured Silicone Resin
SC2001
Heat Cured Silicone Resin
SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices. It has exceptional high temperature properties.
UR5528
Chemically Resistant Polyurethane Resin
UR5528
Chemically Resistant Polyurethane Resin
Chemically resistant polyurethane resin for potting and encapsulation of electronics, suitable for a wide variety of applications.
UR5044
Soft / Digoutable, Flame Retardant Polyurethane Resin
UR5044
Soft / Digoutable, Flame Retardant Polyurethane Resin
Flame retardant polyurethane resin which is UL94 approved. It is soft enough to dig-out for units requiring rework such as prototypes and is flexible through a wide temperature range. May be a good alternative to a Silicone Resin.
Electrolube values and respects your privacy. Please read the Privacy Notice for more information.
Our unrivalled, very personal customer service also extends to every corner of the world. You can rely on our fully trained staff to be knowledgeable and up to speed with the latest technological developments. Having a named single point of contact helps ensure we work closely with our customers, solving problems in the most efficient way possible. For the latest news and updates from Electrolube, follow us on our social channels using the links below: