Compare Thermal Management Solutions Products

	TBS Thermal Bonding System View Product	View Product	TBS Thermal Bonding System View Product	TBS Thermal Bonding System View Product
Type
Silicone
Non-silicone
Cure / Bonding
Yes
No
Interface / Gap Filling / Encapsulation
Interface
Gap filling
Encapsulation
Viscosity (Pa.s)
Viscosity Max	80
Viscosity Min	70
Thermal Conductivity (W/m.K)
Thermal Conductivity (W/m.K)	1.10
Temperature (°C)
Min Temperature	-40
Max Temperature	120
Electrically insulating
Yes
No
Density (g/mL)
Density (g/mL)	1.85
Flame retardency
Yes
No
Application method
Screen printing
Auto/Manual Dispensing
Gap pad
	Request a sample Buy from a distributor	Request a sample Buy from a distributor	Request a sample Buy from a distributor	Request a sample Buy from a distributor

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